J-STD-033 Dry bake and MSL packaging Electronic devices encapsulated with plastic compounds and other organic materials are sensitive to moisture. Moisture from atmospheric humidity will enter permeable packaging materials by diffusion. During solder reflow, the combination of rapid moisture expansion and materials mismatch can result in package cracking and/or delamination of critical interfaces within the package. The damage that occurs may or may not be visible from the outside, making defects very difficult to detect in normal production environments.
At Corfin, moisture sensitive devices are processed, maintained, and packaged with great consideration of the potential damage caused by moisture absorption into the package.